SX-SDPGN System-in-Package (SiP)

802.11b/g/n SDIO System-in-Package (SiP)

The SX-SDPGN is an 802.11b/g/n radio/baseband SDIO System-in-Package (SiP) designed specifically for low power embedded applications.

Top Features:

  • Lowest cost 802.11b/g/n implementation
  • Smallest footprint for space constrained devices
  • Very low power consumption for battery powered devices

Applications:

The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third-generation Wireless LAN solution, featuring 802.11n for portable electronics devices. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power efficiency to portable devices including patient monitors, printers, handheld terminals and more.

The SX-SDPGN is a System-in-Package (SiP) designed to be mounted directly on the device PCBA. This design approach minimizes cost by eliminating extra materials (i.e. PCB and connectors) and labor associated with a radio module or card.

Features and Benefits:

  • IEEE 802.11b/g/n 2.4 GHz
  • Integrated CMOS Eā€‘cient Power Ampli­er (EPA™), LNA
  • Adaptive radio biasing for low-power or high-performance modes
  • Industry-leading receive sensitivity
  • No external EEPROM required for RF calibration
  • Integrated RISC processor
  • Support for industry standard QoS schemes (802.11e, WMM, WMM-PS)
  • Hardware accelerated security, including WAPI (China)
  • High RBOM integration enables design flexibility and lowest cost
  • Smallest foot print for space constrained devices
  • Direct antenna connection eliminates the need for complicated RF tuning and calibration

 

SX-SDPGN (specifications)

Product Name: SX-SDPGN

Chipset: Qualcomm Atheros AR6003

Operating Voltage: VDD 3.3V, AVDD 1.8V

Radio Specifications: 802.11b/g/n 2.412-2.484 GHz

Radio Transmit Power (Typical):

Parameter
802.11b mask comp
802.11g mask comp 
802.11n HT20 mask comp 
802.11g EVM comp
802.11n EVM comp

Condition
1 Mbps
6 Mbps
MCS0
54 Mbps
MCS7

Typical dBm
18.5 dBm
19.0 dBm
18.5 dBm
16.5 dBm
13.0 dBm

Dimensions: 8.3 x 9.2 x 1.015 mm

Storage Temperature: -45 to +135 degrees C°

Operating Temperature: -20 to +85 degrees C°

 

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