SX-SDPGN

802.11b/g/n SDIO System-in-Package (SIP)

 SX-SDPGN
  • Overview
  • Features
  • Specifications

The SX-SDPGN is an 802.11b/g/n radio/baseband SDIO System-in-Package (SiP) designed specially for low power embedded applications. Features include: 

  • Lowest cost 802.11b/g/n implementation
  • Smallest footprint for space constrained devices
  • Very low power consumption for battery powered devices

The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third-generation Wireless LAN solution, featuring 802.11n for portable electronics devices. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power efficiency to portable devices including patient monitors, printers, handheld terminals and more.

The SX-SDPGN is ideal for high volume Wireless LAN applications. The SX-SDPGN is a System-in-Package (SiP) designed to be mounted directly on the device PCBA. This design approach minimizes cost by eliminating extra materials (i.e. PCB and connectors) and labor associated with a radio module or card.

SX-SDPGN Diagram

SX-SDPGN Dimensions

Product Name
 SX-SDPGN
Chipset Qualcomm Atheros AR6003
Operating Voltage VDD 3.3V, AVDD 1.8V
Radio Specifications

802.11b/g/n 2.412-2.484 GHz
Radio Transmit Power (Typical) Parameter
802.11b mask comp
802.11g mask comp
802.11n HT20 mask comp
802.11g EVM comp
802.11n EVM comp		 Condition
1 Mbps
6 Mbps
MCS0
54 Mbps
MCS7		 Typical dBm
18.5 dBm
19.0 dBm
18.5 dBm
16.5 dBm
13.0 dBm
Dimensions
 8.3 x 9.2 x 1.015 mm
Storage Temperature -45 to +135 degrees C°
Operating Temperature -20 to +85 degrees C°